IP3 2024 – Semiconductor Manufacturing (Lot 13791)
This lot is generally related to the fabrication of semiconductor devices such as integrated circuits (ICs) and the technique to remove an oxide from a substrate to improve device performance and reliability. Techniques are disclosed to remove native oxide from a substrate by exposing the substrate to dicyclopentadienyl magnesium (MgCp2) for a predetermined time to remove the oxide. The technology may be implemented in semiconductor fabrication, substrate surface cleaning systems, etc.