Thermal Management of Three-Dimensional Integrated Circuits (DEAL 529)

This lot is generally related to thermal management in three-dimensional (3D) integrated circuits (ICs) to improve the cooling performance of the IC. Disclosed is a 3D integrated circuit consisting of a substrate, a thermal interface layer, and a die. The technique binds a device layer between the thermal interface layer and the die to enhance conductive heat transfer. Also disclosed is a heat sink attached next to a heat spreader so that the thermal interface layer, the die, and the device layer are located between the heat spreader and the substrate. Further disclosed that the 3D IC device, the substrate, the thermal interface layer, the die, the device layer, and the heatsink are placed on top of each other so that the high-conductivity inserts can be arranged in the ring configuration to achieve higher circuit performance. The technology may be implemented in ICs, 3D integrated circuits, thermal management in ICs, etc.