Advanced Flip Chip Packaging Method for Semiconductor Devices (DEAL 452)

This lot is generally related to an improved technique of flip chip packaging which allows a pad of the chip and the substrate to face each other to provide superior electric characteristic and reliability. Disclosed is a flip chip consisting of an insulating layer connected to a substrate, a metal patterned seed layer connected with the insulating layer and form a plate bump layer on the metal patterned seed layer to form multiple bumps to package an inexpensive flip chip. The technology may be implemented in flip chip fabricating system, semiconductor packaging, etc.